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ASNA Thin Film Graphic

Thin Film, such as HDPCVD, PECVD, SACVD, PVD and ALD, along with Dry Etch and Ashing processes present harsh plasma and gas environments, often at elevated temperatures. Where traditional seals might break down in these conditions, Applied Seals next-generation compounds have excellent chemical and thermal resistance and are virtually impervious to extreme fabrication processes . Applied Seals compounds are proven to extend PM cycles and improve yields, which result in an overall lower cost of ownership and improved production.

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Applied Seals PERFREZ® 6022 is proven to improve seal life and lower overall cost of ownership. The below visuals show an incumbant seal material after running 20,000 wafers, scompared to the superior performance of PERFREZ 6022 after 30,000 wafers.

Incumbent material after 20,000 wafers

PERFREZ 6022 after 30,000 wafers

Applied Seals PERFREZ 6012 shows exceptional O2 plasma resistance with minimal weight loss. The photos below show Applied Seals PERFREZ 6012 integrity vs. the competitor's material. Visible cracks and breakdown of the competitor's seal are visible after 30,000 wafers, where PERFREZ 6012 shows no significant sign of wear.

PERFREZ 6012 after 30,000 wafers

Comp. 8X series, zoomed in, after 30,000 wafers

TM by ICP-MS for 30 Elements in Polymer Material