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ASNA Thermal Graphic

Applied Seals compounds are proven to have excellent thermal stability and maintain seal integrity at elevated temperatures often found in processes such as Oxidation, Diffusion, Annealing and RTP. Our ultra pure, highly engineered materials exhibit extremely low outgassing throughout thermal process temperature ranges and generate fewer particles in reaction chambers.

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Excellent thermal stability shown throughout full range of process temperatures. Competitive materials show cracking at 300°C after 72 hours while PERFREZ ® seals maintain their integrity across the full temperature range.

The following TGA (Thermo Gravimetric Analysis) analysis chart shows impressively low weight-loss, or out-gassing, performance for PERFREZ materials throughout their operating temperature range.